MICROMINIATURE INTEGRATED CIRCUIT PACKAGE.
Abstract
Twenty-four molecular electronic blocks were encapsulated in the .225 X .225 X .045 integrated circuit package. No problems in assembly or sealing were encountered. Also six audio amplifiers and two detectors were encapsulated. Two 10.3 mc quartz crystal and eight 455 kc filters were purchased. These devices and components were forwarded with 90 sealed integrated circuit packages to the Signal Corps to fulfill sample requirements. Also a thorough study of packages fabricated utilizing improved processing techniques were sealed and measured for hermeticity. These were lower in leak rate than previous packages by at least one order of magnitude. These same packages were forwarded to CEC for RADIFLO comparison measurements. A pilot run of 1000 microminiature integrated circuit packages was started in March. Application data for integrated circuit assembly in the .220 X .220 package was prepared. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1963
- Accession Number
- AD0424553
Entities
People
- E. P. Barbaro
Organizations
- Westinghouse Electric Corporation