PRODUCTION ENGINEERING MEASURES TO INCREASE TRANSISTOR RELIABILITY PLACED BY U.S. ARMY ELECTRONICS MATERIEL AGENCY, PHILADELPHIA, PENNSYLVANIA.
Abstract
Work continued on the process items scheduled in the program, and progress was made in the following areas: (l) planar production diffusion processes are being optimized quite satisfactorily, and mesa diffusion process specifications have been tightened to take full advantage of improved capabilities; (2) contact window stains have been minimized and the quality and control of the evaporated contacts have been greatly improved; (3) ultrasonic cold bonding of aluminum wire to evaporated aluminum contacts and aluminum wire welded to gold plated header posts are passing all tests satisfactorily; and (4) the planar device is being placed into production and yields and quality are good. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 31, 1963
- Accession Number
- AD0424973
Entities
People
- Earl Gomersall
- Elmer Wolff
- James H. Overman
- Milton K. Mack
Organizations
- Texas Instruments