HIGH CURRENT AND HIGH VOLTAGE SILICON CONTROLLED RECTIFIERS.

Abstract

Results of recent device evaluation indicates that, though silicon material to date has been adequate, there remains the need to monitor crystal sources to be assured of sufficient supply to meet contract commitments. The unique CBE (Compression Bonded Encapsulation) approach to device packaging is described. Data of state-ofart samples delivered to the Navy Department are reported. They indicate the basic device design and its encapsulation to be appropriate to the present stage of the development program. It is noted that modifications are necessary to improve the yield of devices which are in-spec for all electrical characteristics. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 30, 1963
Accession Number
AD0425394

Entities

Organizations

  • Westinghouse Electric Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Compression
  • Contracts
  • Encapsulation
  • High Voltage
  • Materials
  • Navy
  • Packaging
  • Rectifiers
  • Silicon Controlled Rectifiers
  • Test And Evaluation
  • Voltage

Readers

  • Electrical Engineering
  • Software Engineering