MECHANIZATION OF SEMICONDUCTOR DEVICES 2N559 - 2N1094.
Abstract
Contents: Refinement of Phase 1 Machines; Wire Bonding; Stripe Evaporation and Alloying; Header Thermal Capability; Wire Welding; Material Handling; Pneumatic Components; Diffusion, silicon Dioxide Coating; and Header Internal Lead Trimming.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 30, 1963
- Accession Number
- AD0425828
Entities
People
- M. N. Reppert