SPIRALLOY DISKS AND WAFERS SUBJECT TO RADIAL BOUNDARY FORCES,

Abstract

Equations are derived for the stresses, strains, and radial displacement in circular spiralloy disks and wafers which are subjected to radial forces along its internal and external boundaries. The wafers have constant directional material properties, while the disks have variable moduli of elasticity, but a constant Poisson's ratio. Disk solutions are found when the moduli of elasticity in the circumferential and in the radial directions vary with the radius raised to the same power. It is found that the maximum circumferential stress in a spiralloy wafer can be at either boundary, depending upon the ratio of external to internal radii and the ratio of its directional moduli of elasticity. At times the stress distribution bears little resemblance to the corresponding stress distribution of classical elasticity. It is also found that the maximum stress may be significantly altered by fabricating the spiralloy disks with variable moduli of elasticity. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 30, 1963
Accession Number
AD0426240

Entities

People

  • Bernard W. Shaffer

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Boundaries
  • Directional
  • Displacement
  • Elastic Properties
  • Equations
  • Materials

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Structural Dynamics.