MECHANISM OF FATIGUE IN CLOSE PACKED CRYSTALS.

Abstract

Face-centered cubic materials of high and low stacking fault energy were fatigued at both room temperature and liquid nitrogen temperature. Observation of the mode of crack formation, using the electron microscope together with a process of successive replication, showed that the fatigue crack begins as a series of surface cavi ties which propagate and join to form a micro crack. Application of low temperature did not change this basic behavior except to make the cavity formation process more discrete and bear a closer resemblance to the void formations ob served in high temperature creep. Such void formations have been attributed to a process of vacancy condensation. Based upon this observa tion, a low-temperature fatigue mechanism was proposed which utilizes the dislocation to sweep up point defects, created by the non-conserva tive motion of dislocation jogs, and deposit them on suitable nuclei on the external surface to form voids. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1963
Accession Number
AD0426562

Entities

People

  • M.a. Wilkov

Organizations

  • Pennsylvania State University

Tags

DTIC Thesaurus Topics

  • Condensation
  • Crystal Structure
  • Crystals
  • Dislocations
  • Electron Microscopes
  • Electrons
  • High Temperature
  • Low Temperature
  • Materials
  • Microscopes
  • Nitrogen
  • Observation
  • Point Defects
  • Transition Temperature

Readers

  • Materials Science (Mechanical Engineering).
  • Powder metallurgy of Titanium alloys.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene