MICROMINIATURE INTEGRATED CIRCUIT PACKAGE
Abstract
Design and fabrication of two metal to glass seal microminiature integrated circuit packages were completed. One which utilized the .310 inch square ceramic base as an integral portion of the package and the other a .225 in. square package per the stated requirements of the contract, the .310 in. square package required more development as leak rates of only less than 1 x 10 to the minus 6 power cc/sec at one atmosphere were achieved. However, on the contract package lead rates less than 1 x 10 to the minus 8 power cc/sec at one atmosphere were attained. This was accomplished through revisions of graphite molds, glass preform designs, kovar oxide layer control and sealing techniques. To prove package feasibility, twenty-four Westing house Functional Electronic Blocks were encapsulated in the .225 in. square microminiature planar package. No problems in assembly were encountered.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1963
- Accession Number
- AD0426956
Entities
People
- E. P. Barbaro
Organizations
- Westinghouse Electric Corporation