INVESTIGATION OF BONDING IN OXIDE-FIBER (WHISKER) REINFORCED METALS.

Abstract

Special binary alloys of pure Ni containing 1 at.-% of Al, Cu, In, Ti, Zr and Cr were prepared and were used in sessile drop experiments, which were conducted at temperatures ranging between 1460 and 1510 C and at pressures of 5 x 10 to the -5th power Torr. It was found that the additions of Al, Cu, and In had little effect in lowering the contact angle between pure Ni and single crystal substrates of alpha-Al2O3. However, the Ti, Zr and Cr additions, which reacted chemically with the substrate, lowered the contact angle significantly. Future studies are planned which will study the effect of interfacial reactions on the bond strength between the Ni/Ni alloys and alpha-Al2O3. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 30, 1963
Accession Number
AD0427056

Entities

People

  • Willard H. Sutton

Organizations

  • General Electric

Tags

DTIC Thesaurus Topics

  • Alloys
  • Binary Alloys
  • Single Crystals
  • Substrates

Readers

  • Surface Engineering/Surface Coating Technology.
  • Thin Film Deposition Science.