THERMOELECTRIC MATERIALS AND FABRICATION.

Abstract

The results of studies of techniques for improving the technology of thermoelectric power-generating devices are reported. Aspects of the problem covered in the present program include (1) techniques for metallurgical processing of semiconductor materials, (2) methods of forming metallurgical bonds, (3) methods of evaluating materials and bonds, (4) methods of forming electrically insulating, thermally conducting bonds, (5) methods of encapsulation of thermoelectric components, (6) analysis of thermal and mechanical stresses in bond regions, and (7) considerations relevant to the selection of element size and packing density in chemically heated power-generating devices. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1963
Accession Number
AD0427334

Entities

People

  • D. Peery
  • E. Brady
  • H. Jansen
  • R. Moss
  • R. Overmyer

Organizations

  • General Dynamics

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Carbides
  • Chemical Compounds
  • Coatings
  • Compound Semiconductors
  • Electronics
  • Encapsulation
  • Fabrication
  • Inorganic Carbon Compounds
  • Inorganic Chemicals
  • Materials
  • Microcapsules
  • Packing Density
  • Semiconductors
  • Solid State Electronics

Fields of Study

  • Materials science

Readers

  • Fluid Dynamics.
  • Systems Analysis and Design
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics