THE ANALYSIS OF FRACTURE SURFACES BY ELECTRON MICROSCOPY

Abstract

This paper reviews and illustrates the characteristic features of the following modes of fracture: (1) Transgranular fracture which can take place either - by cleavage along crystallographic planes - or by the formation and coalescence of microvoids which leave concave depressions called ''dimples'' on both fracture surfaces, - or by the slow progression of a fatigue crack by a mixed ductile - cleavage mode of fracture. (2) Intergranular fracture which is either - brittle when there is a perfect separation of the grains along the grain boundaries, - or ductile when this separation is associated with the plastic formation of void along the grain boundaries.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1963
Accession Number
AD0428452

Entities

People

  • Regis M. Pelloux

Organizations

  • Boeing

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Aluminum Alloys
  • Chemistry
  • Composite Materials
  • Crack Propagation
  • Cracks
  • Crystal Structure
  • Crystals
  • Electron Microscopes
  • Electron Microscopy
  • Grain Boundaries
  • Hydrogen Embrittlement
  • Materials
  • Orientation (Direction)
  • Phase
  • Solid Solutions
  • Tensile Stress
  • Transition Temperature

Readers

  • Materials Science (Mechanical Engineering).

Technology Areas

  • Microelectronics