PRODUCTION ENGINEERING MEASURE 2N914 AND 2N995, VOLUME I.

Abstract

Efforts concerned the establishement of a production engineering measure for improvement of production techniques to increase the relia bility of 2N914 and 2N995 silicon planar epitaxial transistors. Processes improved included: Lead attachment; Preparation of substrate for epitaxial growth; Header plating; Particle elimination; and Aluminum deposition. This volume presents the results of the lead attachment improvement phase of the program. The change in metal systems, small ball bonding, wire study, ultrasonic bonding and dynamic and step stress testing. (Vol. II is AD429 921). (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 31, 1963
Accession Number
AD0429920

Entities

People

  • P. M. Weiler

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Aluminum
  • Attachment
  • Elimination
  • Engineering
  • Epitaxial Growth
  • Metals
  • Particles
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Substrates
  • Transistors

Readers

  • Semiconductor Device Technology
  • Software Engineering
  • Surface Engineering/Surface Coating Technology.