An Appraisal of Transistor Thermal Resistance and Junction Temperature
Abstract
The current state-of-the-art of pulsed thermal resistance measurements is reviewed. Some of the reasons are presented for the apparent lack of correlation in thermal measurements when these techniques are used. Two techniques of continuous thermal resistance measurements are presented and possible sources of error indicated. Some preliminary data is presented which indicates that thermal resistance measurements made by the continuous hFE technique is the most sensitive method currently known.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1963
- Accession Number
- AD0430144
Entities
People
- Bernard Reich
- Edward B. Hakim
Organizations
- United States Army Communications-Electronics Command