DEFORMATION CHARACTERISTICS OF THIN FOILS AND COMPOSITES.

Abstract

The tensile behavior of copper foils prepared from rolled bulk material has been studied over the thickness range 2 to 53 microns, and for a wide range of grain sizes. For foils of comparable grain size, yield strength increases with decreasing foil thickness t below about 26 microns, with a corresponding decrease in ductility. Glide dislocation configurations in zone melted single crystals of molybdenum, deformed in tension at temperatures in the range 4.2 to 300 K, have been examined by thin film electron transmission microscopy. The slip band structure is characterized by long primary screw dislocations. Consistent with the presence of secondary slip, the bulk stress-strain curves do not exhibit a region of easy glide. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1964
Accession Number
AD0430902

Entities

People

  • Alan Lawłey
  • Horace L. Gaigher
  • Sidney Schuster

Organizations

  • Franklin Institute

Tags

DTIC Thesaurus Topics

  • Band Structures
  • Bulk Materials
  • Composite Materials
  • Dislocations
  • Energy Bands
  • Films
  • Grain Size
  • Materials
  • Single Crystals
  • Stress Strain Relations
  • Thickness
  • Thin Films
  • Yield Strength

Fields of Study

  • Materials science
  • Physics

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene