ABLATION SHIELD DEVELOPMENT TESTING - ADHESIVE EVALUATION AND ELEVATED TEMPERATURE PROPERTIES
Abstract
Surfaces of beryllium finger panels were processed for adhesive bonding. Various film adhesives and bonding methods for each adhesive were then used in bonding the beryllium finger panels together. After bond line curing the bonded finger panels were machined into individual lap shear tension test specimens. Test specimens were subjected to a series of tests for adhesive shear strength at room and elevated temperatures. Although the lap shear strength of HT-424 film adhesive was lower than other adhesives tested at room temperature and 500 deg F its greater strength at 650 deg F and 800 deg F makes it the most desireable adhesive for use in bonding applications involving beryllium and high temperature environments.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 10, 1964
- Accession Number
- AD0431509
Entities
People
- Henry E. Reiling
Organizations
- McDonnell Aircraft Corporation