ENHANCED MICRO-MODULE INTERCONNECTIONS. (AN HERMETIC PACKAGING SYSTEM FOR THE INTEGRATION OF MICRO CIRCUITS).

Abstract

Effort was directed toward the evolution of previously developed processes into manufacturing techniques. In addition, electrical testing procedures were compiled and test circuits assembled and checked-out. Twenty solid-state microcircuit wafers, each provided with two integrated circuits were assembled, tested, and submitted as samples. Several microwafer stack -- header transfer wafer assemblies have been fabricated. These units are provided with microwafers with suitably shorted terminations to permit weld resistance monitoring during vibration to detect any potential open circuits. The majority of the machines required for the establishment of the pilot line have been designed and are in the process of being fabricated and assembled. A 'wired' electronic programmer for the automatic electron beam welding of the copper ribbons and hermetic sealing of the structure has been build and successfully tested. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 31, 1963
Accession Number
AD0432492

Entities

People

  • D. J. Garibotti
  • G. F. Lang

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Additive Manufacturing
  • Assembly
  • Automatic
  • Circuits
  • Electron Beam Welding
  • Electron Beams
  • Electrons
  • Fabrication
  • Integrated Circuits
  • Manufacturing
  • Mass Production
  • Microcircuits
  • Monitoring
  • Packaging
  • Personal Information Managers
  • Resistance
  • Vibration

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Microelectromechanical Systems