PACKAGING MINIATURIZATION. CHARGE NUMBERS 31-8027-0201-01, 31-8027-0901 AND RES 2 AND 4,

Abstract

High Power Amplifier Para-Plate modules were built and functionally tested. A few prototype modules using Weld Pack and Chem-Mill techniques were constructed. Some prototype Para-Plate low power flip flops were assembled but not evaluated. Several other versions of the low power flip flop were investigated. This report describes the design work and includes illustrations and tables plus preliminary test results, layout artwork, drawings, encapsulation techniques, conclusions and recommendations. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 15, 1961
Accession Number
AD0433115

Entities

People

  • H. L. Newman
  • Shiro Abe
  • Stuart Churchon

Organizations

  • Lockheed Martin Missiles and Space

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Amplifiers
  • Coatings
  • Electronic Amplifier
  • Encapsulation
  • Microcapsules
  • Miniaturization
  • Packaging
  • Power Amplifiers
  • Prototypes

Readers

  • Aerospace Engineering
  • Integrated Circuit Design and Technology.
  • Software Engineering