A POROUS SUBSTRATE RESISTOR AIMED AT MINIATURIZATION OF METAL-FILM RESISTORS.
Abstract
Ceramics with higher thermal conductivity than quartz were investigated. Specifically, alumina was reconsidered for substrate use because of thermal conductivity, availability and cost. Defects in the substrate structure (fused areas, vacancies and non-intercommunication of pores) were analyzed with respect to the parameters of weight-to volume ratio and flow. Results show no significant improvement in structure. Individual brazing of the end cap to the substrate replaced strip brazing used previously. The new method eliminated the need for deburring and refluxing and was superior in strength. The end cap was redesigned to permit the mechanical adjustment of the four surfaces of the substrate and solution (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 01, 1964
- Accession Number
- AD0433270
Entities
People
- R. E. Busch
- T. Matley