LOW-COST MICROCIRCUITS FOR MICROASSEMBLIES.
Abstract
An approach to low-cost resistor and capacitor elements utilizing the microelement wafer concept and the double-etch process is under investigation. Multi-layered films were placed on ceramic substrates by vacumm and electroless deposition techniques to form microelement wafers. The multi-layered films are converted to resistor and capacitor elements by subtractive methods, utilizing xerographic stenciling and selective etching. Data covering T.C.R., temperature cycling, load life stability and yield for resistor elements is presented. The capacitor and micromodule assembly programs are outlined. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1964
- Accession Number
- AD0433891
Entities
People
- C. Mytych
Organizations
- Xerox