THIN FILM TECHNIQUES FOR SILICON INTEGRATED CIRCUITS.

Abstract

Circuit design and masks for the R-C circuit vehicle have been completed, as well as processing of the adapter network and special control pattern. Analysis of data and failure from the first run of the adapter are included. Processing of samples for Phase II is in progress. Further study is planned in the areas of contacting cermet resistors, deposition of nichrome, substrate cleanliness, aluminum silicate capacitor process and glow discharge anodization of capacitors. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 15, 1963
Accession Number
AD0436787

Entities

People

  • Curtis Phillips
  • Eugene Blanchette
  • Richard B Wilson

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum
  • Anodizing
  • Capacitors
  • Circuits
  • Data Analysis
  • Electronic Equipment
  • Films
  • Glow Discharges
  • Integrated Circuits
  • Networks
  • Resistors
  • Silicates
  • Substrates
  • Thin Films

Readers

  • Aerospace Test and Evaluation
  • Integrated Circuit Design and Technology.
  • Surface Engineering/Surface Coating Technology.