FAILURE MECHANISMS IN MICROELECTRONICS.
Abstract
A screening technique by which unreliable devices may be culled prior to completion of fabrication is described. The initial stage of an investigation of SiO2 passivation layers and of process damage which may occur during the fabria typical semiconductor device is presented. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 01, 1964
- Accession Number
- AD0437343
Entities
Organizations
- Westinghouse Electric Corporation