SOLID-STATE COOLING OF FUNCTIONAL ELECTRONIC BLOCKS.
Abstract
Techniques for fabrication of thermoelectric coolers in sizes comparable to solid-state network circuit blocks were investigated. Two laboratory methods for deposition of films of bismuth telluride by vacuum evaporation were devised. These are multiple boat evaporation of tellurium and bismuth at controlled rates and flash evaporation of a mixture of the materials from a hot filament. Films up to 0.0003 inch thick were made. The principal problem encountered was differential thermal contraction between film and substrate during cooling. Glass substrates were used in the experiments. An improved substrate material is needed. Prototype thermoelectric coolers were fabricated by two methods: photoetching of raw material sheets to provide individual elements and manual assembly of individual elements in an epoxy matrix. The latter method was the more successful. A satisfactory technique for assembly of coolers by soldering tabs to the matrices was developed. A module 1 inch square by 0.16 inch thick was constructed and tested. Capacity was approximately 10 watts at 45 C delta T. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- May 07, 1964
- Accession Number
- AD0439203
Entities
Organizations
- Texas Instruments