PLANAR INTEGRATION OF THIN FILM UNITS.
Abstract
A simple analysis of the stresses induced in the bridging material and deposited interconnection from thermal cycling was made for the purpose of providing guidelines for the selection of material to accomplish the desired objective. Conclusions were: (1) the thermal expansion of substrate should be greater than the chip; (2) the bridging material should be a close match of the thermal expansion of the system and (3) the ratio of hole depth to width should be as small as possible. Although the guidelines as established cannot be completely satisfied by the given materials and geometry, without a severe stringency on the thermal expansion requirements, this requirement can be relaxed somewhat by a material with ductility or flexibility. An investigation of candidate bridging materials was conducted. The organic materials were Doryl varnish, Resiweld epoxy and Kimble glass resin. The other category was low temperature glasses. The vitrified glasses included Kimble SG7 and Corning 1826, and devitrified glasses included Pyroceram 95, and Kimble CV 101 and CV 137. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 14, 1964
- Accession Number
- AD0442157
Entities
People
- C. A. Harper
- C. W. Wyble
- J. M. Winter
- M. Lauriente