THE THERMAL CONDUCTIVITY, THERMOELECTRIC POWER, AND THE ELECTRICAL RESISTIVITY OF STOICHIOMETRIC TINI IN THE 3 TO 300 K TEMPERATURE RANGE,

Abstract

The thermal conductivity, thermoelectric power, and the electrical resistivity of some stoichiometric TiNi samples and alloys containing Cu and excess Ni have been measured in order to explore the lattice component of the thermal conductivity. It has been found that the low temperature phonon mean-free-path is independent of temperature, depends upon solute species, and increases with solute concentration. In addition the ideal component of the electrical restivity shows the T to the 2nd power dependence below 100 K found for the element Mn and alloys with this same electron number. Values of the fermi energy, effective mass, and the relative valence of the solutes are derived. Finally, one of the alloyed samples exhibits phase changes which are believed related to those seen in the pure material at temperatures above 300 K. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 04, 1964
Accession Number
AD0447575

Entities

People

  • J. F. Goff

Organizations

  • Naval Ordnance Laboratory

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Conductivity
  • Electrical Conductivity
  • Electrical Properties
  • Electricity
  • Electrons
  • Fermi Levels
  • Low Temperature
  • Materials
  • Mean Free Path
  • Physical Properties
  • Quantum Properties
  • Thermal Conductivity

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Thermal Physics or Thermal Science.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene