PLANAR INTEGRATION OF THIN FILM UNITS.
Abstract
The object of this study is to establish and demonstrate highly reliable and practical methods for mounting and subsequent simultaneous interconnection of discrete chip parts and silicon semiconductor integrated circuits to previously deposited thin film circuitry on a common microcircuit wafer. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 14, 1964
- Accession Number
- AD0447713
Entities
People
- C. W. Wyble
- J. M. Winter
- M. Lauriente