AN ECONOMICAL FLAT PACKAGE FOR INTEGRATED CIRCUITS.

Abstract

The schedule for making the first seal of the metal leads to the package substrate is complete. By a process of electroplating and etching metal film interconnections have been laid down, but many problems remain in this area. A few circuits were assembled on this substrate and where all previous steps were satisfactory, electrical continuity has been established. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 15, 1964
Accession Number
AD0450549

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Circuits
  • Coatings
  • Continuity
  • Deposition (Materials Processing)
  • Electroplating
  • Films
  • Integrated Circuits
  • Materials
  • Materials Processing
  • Metal Films
  • Substrates

Readers

  • Integrated Circuit Design and Technology.
  • Operations Research
  • Surface Engineering/Surface Coating Technology.