MODULAR INTERCONNECTIONS FOR HERMETIC MICRO-ASSEMBLIES.
Abstract
The three major objectives pursued during the course of this program were: Task A. Modular Interconnection and Hermetic Sealing of Micro-Assembly Stacks. Ten wafer microassembly stacks fabricated by electron beam processes have been connected to the pins of hermetic headers by transform interconnecting media and hermetically sealed within electron beam welded cans. Task B. - Hermetic Sealing of Soldered Micro-Module Element Stacks. Soldered Micro-Module stacks were integrated with hermetic headers and the resultant structures hermetically sealed within an electron beam welded can. Task C. - Evaluation of Electron Beam Microwelds to Discrete Terminations. A high resolution metalizing process was developed for the formation of closely spaced terminations on all four edges of .310 x .310 inch substrates. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1964
- Accession Number
- AD0451748
Entities
People
- D. J. Garibotti
- J. E. Taylor