HIGH-TEMPERATURE ADHESIVES AND RESINS.
Abstract
High-density 2-ply polymide laminates were prepared with flexural strengths and moduli of 90,300 psi and 2,720,000 psi at room temperature and 53,200 psi and 2,550,000 psi after 24 hrs. at 600 F respectively. Attempts to fabricate highdensity 14-ply poly (m-phenylene-3,3',4,4'-benzophenonetetracarboxylimide) laminates with high initial strengths were unsuccessful. Poly(mphenylene-3,3',4,4'-benzophenonetetracarboxylimide) exhibited excellent thermal stability under isothermal conditions. Low molecular wt. polybenzothiazole was prepared by cyclizing a precursor polyamidethiol obtained from the reaction of free 3,3'-dimercaptobenzidine and isophthaloyl chloride. The polymer, although of low molecular wt., had a polymer decomposition temperature in static air of 545 C and retained 71% of its wt. after 50 hrs. at 700 F in static air. The scaled-up preparation of 3,3'dimercaptobenzidine dihydrochloride gave an overall yield of 50% of polymer grade material which will be used for polybenzothiazole adhesive and laminate development work. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1964
- Accession Number
- AD0452338
Entities
People
- Harold H. Levine
- Jerry L. Kerkmeyer
- Paul M. Hergenrother