RELIABLE DIELECTRIC FILMS FOR MICROCIRCUITS
Abstract
Contents: Dielectric Breakdown at Conductor Edges--The Edge Effect; Properties and Performance of SiO Capacitors; Interrelation of Deposition Parameters (Rate and Dielectric Thickness) with Dielectric Properties; Leakage Resistance, Dissipation Factor, Temperature Coefficient of Capacitance (TCC); progress of Life Tests at 85 C and 125 C; 85 C Life Tests; 125 C Life Tests; Sputtered Dielectric Films; Silicon Nitride; Other Reactively Sputtered Dielectrics; Cross-Sectioning of Thin Films.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 26, 1964
- Accession Number
- AD0453220
Entities
People
- Gilbert A. St. John
- Saul W. Chaikin
Organizations
- SRI International