AN INVESTIGATION OF SEALING TECHNIQUES FOR ELECTROEXPLOSIVE DEVICES

Abstract

Epoxy resins, solder amalgams, and high temperature solders were investigated for use in hermetically sealing electro-explosive devices. An epoxy resin gave a non-hermetic, but a water tight seal, solder amalgams gave poor seals, and solders with melting points up to 600 F were successfully used to hermetically seal electroexplosive components.

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Document Details

Document Type
Technical Report
Publication Date
May 25, 1965
Accession Number
AD0465420

Entities

People

  • Louis J. Montesi

Organizations

  • Naval Ordnance Laboratory

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Abstracts
  • Copper
  • Epoxy Resins
  • Explosions
  • Explosive Devices
  • Explosives
  • Frequency
  • High Temperature
  • Materials
  • Materials Laboratories
  • Melting Point
  • Munitions
  • Ordnance Laboratories
  • Plastics
  • Resins
  • Silica Gels
  • United States

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