AN ECONOMICAL FLAT PACKAGE FOR INTEGRATED CIRCUITS.

Abstract

The ultrasonic bonding method was extensively reevaluated after observing in process bond failures. Corrective measures have been instituted and improvement is seen on initial testing. (Author)

Document Details

• Document Type: Technical Report
• Publication Date: Jun 17, 1965
• Accession Number: AD0465782

Tags

Communities of Interest

• Materials and Manufacturing Processes

DTIC Thesaurus Topics

• Circuits
• Electrical Circuits
• Electrical Equipment
• Electronic Circuits
• Electronic Equipment
• Electronics
• Integrated Circuits
• Networks

Readers

• Software Engineering
• Surface Engineering/Surface Coating Technology.