REPORT ON PHASE I OF THE FEASIBILITY COMMITTEE FOR 200,000 FOOT ALTITUDE INSTRUMENTED HASP,

Abstract

There is very little atmospheric information available above 100,000 feet, and the requirements of Military and other programs which will use such information are not defined in such a way as to justify firm accuracy goals. It is recommended that a transponding sonde (x-band or 403 mega-cycle) be developed and that the final selection of sensors for a mass produced sonde be preceded by flight tests to evaluate the most promising sensors. For initial flights the committee recommends a bead thermistor, for temperature sensing and a single point pressure indicator to operate at 50,000 to 80,000 feet. A number of suggestions are made for other types of temperature and pressure sensors which might be developed for later models. The Committee sees a need for further effort on; (a) descent devices, (b) the ROBIN ballon device, which might fulfill the HASP requirement without the use of electronics, and (c) the HASP wind tunnel. It is felt that firing of the telemetering only (non-transponding) rounds designed for lower altitudes will yield information useful to the present HASP objectives. The Committee also believes that the HASP program would benefit from association with a modest program of upper atmosphere research. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 15, 1959
Accession Number
AD0468204

Entities

People

  • B. L. Snavely
  • E. P. Trounson
  • J. M. Kendall
  • M. J. Parker
  • S. J. Raff

Organizations

  • Naval Ordnance Laboratory

Tags

Communities of Interest

  • Sensors

DTIC Thesaurus Topics

  • Accuracy
  • Altitude
  • Atmospheres
  • Electronics
  • Indicators
  • Power Electronics
  • Semiconductor Devices
  • Semiconductors
  • Solid State Electronics
  • Thermistors
  • Wind Tunnels
  • X Band

Readers

  • Aerospace Test and Evaluation
  • Fluid Dynamics.
  • Neural Network Machine Learning.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems