THE MINISTICK PROCESS FOR PACKAGING INTEGRATED CIRCUIT FLAT PACKS.
Abstract
The Ministick process for fabricating flat-pack type multilayer circuitry boards has been developed because of the need for space circuitry that meets ease of design and manufacture requirements. Starting with a circuit design in the form of a logic diagram, the design phase progresses to the final artwork template. This template, photo reduced, is the basic tool in the fabrication of the assembly frames. The circuit of each layer of an assembly frame is produced by chemically milling substrates which have been sensitized with the desired circuit by use of the final artwork template. These substrates are made by laminating an epoxy glass cloth dielectric material to a Kovar sheet. Individual circuit layers are then combined to form an assembly frame, and Integrated Circuit modules are welded to the frame to complete the circuitry. When more than one assembly frame is required to complete the circuitry, the frames are electrically connected by means of a mother board. Although multilayer circuit boards are used in this procedure, no interlayer connections are required. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1965
- Accession Number
- AD0468378
Entities
People
- Carlton F. Noyes
Organizations
- Johns Hopkins University