DESIGN PARAMETERS AND PROCEDURES FOR FUNCTIONAL ELECTRONIC STRUCTURES.

Abstract

Experimental and theoretical research on silicon integrated device structures and on the elements of these structures is discussed. Included are a description of oxide film thickness measurement apparatus, data on low temperature silicon oxidation rates, observations on the dependence of oxide growth rate on phosphorus concentration in the silicon, and theoretical treatment of field effect transistor characteristics. The series of reports on Integrated Silicon Device Technology is described and their status given. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1965
Accession Number
AD0469962

Entities

Organizations

  • RTI International

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemical Compounds
  • Elements
  • Field Effect Transistors
  • Films
  • Low Temperature
  • Measurement
  • Observation
  • Ores
  • Oxidation
  • Oxide Films
  • Oxides
  • Oxygen Compounds
  • Phosphorus
  • Rocks And Deposits
  • Thickness
  • Transistors

Readers

  • Materials Science and Engineering.
  • Powder metallurgy of Titanium alloys.
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene