LIQUID METAL EMBRITTLEMENT

Abstract

An electron microscope investigation of the embrittlement of copper by liquid bismuth has been carried out. Observations were made above the melting point of bismuth (271 deg C) and at room temperature. A uniform bismuth film was formed by evaporation on a thinned copper foil. When this film melted, it tended to agglomerate (depending on the vacuum conditions and surface preparation prior to deposition) and flow along grain boundaries. The rate of flow increased considerably when a tensile stress was applied. Boundaries in contact with liquid bismuth at temperatures above 271 deg C were brittle. Boundaries exposed to liquid bismuth for several hours and tested at room temperature were brittle also. The intergranular nature of the embrittlement was verified by transmission electron diffraction and electron microscopy. No evidence for disloaction pile-ups acting to initiate brittle fracture was obtained.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1965
Accession Number
AD0470526

Entities

People

  • Richard W. Vook

Organizations

  • Franklin Institute

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Boundaries
  • Crack Tips
  • Crystals
  • Diffraction
  • Electron Beams
  • Electron Diffraction
  • Electron Microscopes
  • Electrons
  • Evaporation
  • Grain Boundaries
  • Liquid Metals
  • Materials
  • Melting Point
  • Microscopes
  • Stresses
  • Tensile Stress
  • United States

Readers

  • Materials Science (Mechanical Engineering).
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene