INTEGRATED CIRCUIT THERMAL STUDY.
Abstract
Results of a study of the thermal considerations in monolithic silicon integral circuit devices are presented. Thermal instrumentation techniques using conventional thermocouples to measure chip temperatures and a method of implementing the use of base to emitter voltage versus temperature characteristic were developed. The usefulness of available infrared equipment was also evaluated. Digital computer implemented thermal analyses were investigated. Data are presented showing the magnitude of thermal gradients and thermal resistances for typical devices in a TO-5 case and in an all ceramic flat package. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 15, 1965
- Accession Number
- AD0474696
Entities
People
- J. R. Baum
Organizations
- Motorola Mobility