RADIO FREQUENCY BONDING.

Abstract

This report describes the results of a program to evaluate methods of measuring the impedance of commonly used bonds. The ultimate goal of this effort is to provide a means to evaluate the performance of electrical bonds in an RFenvironment, in order to aid in the design of avionics equipment and structures to prevent RFI, and to detect the source of existing RFI problems. The program consisted of (1) a literature survey to determine if previous efforts in this field had produced significant or useful results, (2) experimental evaluation of a number of possible techniques, (3) theoretical support for these techniques when practical, and (4) fabrication of an engineering model to demonstrate one of the most applicable techniques. (Author)

Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1965
Accession Number
AD0474924

Entities

People

  • Donald P. Kiwus
  • Robert F. Wood
  • William C. Reisener Jr.

Organizations

  • Franklin Institute

Tags

DTIC Thesaurus Topics

  • Avionics
  • Electronic Equipment
  • Engineering
  • Fabrication
  • Frequency
  • Frequency Bands
  • Impedance
  • Literature
  • Literature Surveys
  • Modules (Electronics)
  • Radio Frequency
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Electronics Engineering
  • Software Engineering
  • Systems Analysis and Design