DEVELOPMENT OF POLYIMIDE RESIN BASED STRUCTURAL ADHESIVES AND LAMINATES FOR LONG TIME HIGH TEMPERATURE USE.

Abstract

Successful use of aromatic polyimide resins as useful adhesive bonds for stainless steel and Ti metals at elevated temperatures is reported. High strength (> 1000 psi) at temperatures up to 700 F were maintained for long aging periods. Life expectancy of the best materials range from about 1500 hours at 550 F to about 40 hours at 700 F. The effect of additives on the aging properties of the polymers was determined. Press conditions for creating a bond are moderate but a high temperature is required. A new copolymer of benzimidazole and imide linkages provided superior bonds for Ti alloys. Optimum formulations and bonding conditions were established. Similar polymer structures are useful in reinforced laminates for periods of 1000 hours or more in air at 600 F. This work was extended to encompass the effects of molecular weight control, copolymer formation, and cross linked imide structures. Considerable improvement in strength properties was realized. Several filler materials including type S994 glass were examined and the effect of glass finishes was studied. Good water boil resistance is possible when the proper finish is employed. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1965
Accession Number
AD0475510

Entities

People

  • Charles R. Ruffing
  • George M. Bower
  • Herbert A. Burgman
  • James H. Freeman
  • Lawrence W. Frost

Tags

DTIC Thesaurus Topics

  • Adhesives
  • Composite Materials
  • Copolymers
  • Films
  • High Temperature
  • Laminates
  • Materials
  • Molecular Weight
  • Plastics
  • Polyimide Resins
  • Polymers
  • Resins
  • Stainless Steel

Fields of Study

  • Materials science

Readers

  • Metallurgy
  • Polymer Science and Engineering.

Technology Areas

  • Microelectronics