STUDY OF CONTACT FAILURES IN SEMICONDUCTOR DEVICES.

Abstract

Work was directed toward a study of interactions at ohmic contacts. Representative ohmic contact systems which are in wide use, or are likely to be used in electronic devices, are being studied. The objective of initial studies was to develop suitable and sensitive techniques for studying interactions at ohmic contacts. Experiments were performed with a number of binary and ternary systems, including Ag-Sn, Au-Cr, Al-Ta, Au-Al, Al-SiO2, Cr-Ta, Al-Mo, Al-(P2O5.SiO2), and Au-Cr-Ta, and data were obtained concerning interactions in these systems. It was concluded that the measurement of sheet resistivity of binary metal thin-film systems using four in-line probes provides a simple technique for performing exploratory tests to determine whether significant interaction occurs at various temperature stresses, and permits a survey of a relatively large number of bimetal couples to be made. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1966
Accession Number
AD0477292

Entities

People

  • George L. Schnable
  • Ralph S. Keen

Tags

DTIC Thesaurus Topics

  • Compound Semiconductors
  • Electronic Equipment
  • Electronics
  • Films
  • Measurement
  • Metal-Semiconductor Junctions
  • Semiconductor Devices
  • Semiconductors
  • Solid State Electronics
  • Thin Films

Readers

  • Materials Science and Engineering.
  • Systems Analysis and Design
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics