EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.

Abstract

The objective of this effort is to perform a critical evaluation of the Flip/Chip approach to interconnecting integrated chip circuits within a common package. The simulation of the package thermal characteristics has been completed. Work is in progress on a matrix experiment on aluminum-to-aluminum ultrasonic bonding conditions. Solder pads have been prepared on 7059 glass substrates and on silicon chips for solder bonding experiments.

Document Details

Document Type
Technical Report
Publication Date
May 13, 1966
Accession Number
AD0482059

Tags

DTIC Thesaurus Topics

  • Aluminum
  • Circuit Interconnections
  • Circuits
  • Integrated Circuits
  • Simulations
  • Substrates
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Thin Film Deposition Science.