THIN FILM THERMISTORS.

Abstract

The effect of thickness on the surface resistivity and ratio has been determined and in general the thinner the film, the higher the material at this time seems to be gold. The leads can be successfully soldered onto the gold by the use of No. 2 solder as supplied by the Indium Corporation of America using a rosin flux. Welded leads are possible on glazed substrates but at present some difficulty is evident on unglazed substrates. Platinum and gold mushes have been found to be not acceptable. The problem of the change in chemical composition through the target material has been reduced and relatively stable targets are now being produced. Aging results show that thermistor material sputtered onto glazed substrates are not stable due to the alkali content in the glaze attacking the thermistor material. Thermistors sputtered onto unglazed beryllium oxide substrates have shown excellent aging characteristics over a 1 month period. The sputtering in a gas containing 5% oxygen resulted in excellent units.

Document Details

Document Type
Technical Report
Publication Date
Dec 23, 1965
Accession Number
AD0484190

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Beryllium
  • Chemical Composition
  • Corporations
  • Films
  • Materials
  • Platinum
  • Sputtering
  • Substrates
  • Thermistors
  • Thickness
  • Thin Films

Fields of Study

  • Materials science

Readers

  • Surface Engineering/Surface Coating Technology.
  • Thermal Physics or Thermal Science.
  • Thin Film Deposition Science.