RESISTORS FOR MICROPOWER CIRCUITS.

Abstract

Micropower resistors with lead wires attached by welding have been prepared. A new ceramic substrate system is employed. Fabrication of many thousands of these substrates with a recently completed hydraulic press has been accomplished. The application of resistive pastes to these substrates has been given considerable attention, and the effects of process variables such as coating thickness and paste viscosity on resistor properties have been examined. Contact problems were encountered in some cases, and investigations of firing schedules and electroplating overlays have been initiated. Variables in the process of attachment of leads with percussive welding equipment have received some preliminary study. An improved helixing machine has been placed in operation, and initial mechanical and electrical difficulties have been eliminated. The effect of certain helixing parameters, such as nozzle to substrate distance and the effect of annealing after helixing have been investigated. Preliminary studies of encapsulation using dummy substrates have also been initiated. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 31, 1966
Accession Number
AD0485369

Entities

People

  • Charles F. Parks

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Coatings
  • Electroplating
  • Encapsulation
  • Fabrication
  • Hydraulic Equipment
  • Hydraulic Presses
  • Lead Wires
  • Machines
  • Material Forming Processes
  • Micropower Circuits
  • Resistors
  • Substrates

Readers

  • Software Engineering
  • Surface Engineering/Surface Coating Technology.