TEMPERATURES AND STRESSES IN THICK-WALLED CYLINDERS AND A COMPARISON WITH WIND TUNNEL EXPERIMENTS.

Abstract

A thick-walled, circular cylinder with an internal subsonic flow of high energy air and an insulated outer surface is analyzed for internal heat transfer, transient temperature distribution, and thermal stresses and deformations. The heat transfer coefficient to the body is determined as a function of time from the airflow conditions. A finite difference solution of the transient, one-dimensional, cylindrical heat conduction equation is used to determine the temperature distribution at any time. Two numerical methods are then applied to obtain the thermoelastic stresses and deformation in the cylinder. The first method is a multi-layer technique, and the second is a finite difference scheme. Both methods consider Young's Modulus and the coefficient of thermal expansion to be temperature dependent. The transient temperature distributions and thermoelastic strains obtained from the analysis are compared with the results of wind tunnel tests performed on five stainless steel models. The temperatures predicted by the finite difference solution of the heat conduction equation are in good agreement with temperature obtained from thermocouples located at the inner and outer surfaces of the cylindrical model; and are in fair agreement with temperatures obtained from thermocouples located in the interior of the model. Thermal strains predicted by the theories agree very well with the experimental strains until the time when the yield stress of the stainless steel was exceeded. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1966
Accession Number
AD0485556

Entities

People

  • J. E. Flaherty
  • S. V. Nardo

Organizations

  • New York University Tandon School of Engineering

Tags

DTIC Thesaurus Topics

  • Agreements
  • Coefficients
  • Energy
  • Equations
  • Heat Transfer
  • Heat Transfer Coefficients
  • High Energy
  • Modulus Of Elasticity
  • Stainless Steel
  • Steel
  • Stresses
  • Subsonic Flow
  • Thermal Expansion
  • Thermal Stresses
  • Wind Tunnel Tests
  • Wind Tunnels

Readers

  • Fluid Dynamics.
  • Mechanical Engineering/Mechanics of Materials.

Technology Areas

  • Microelectronics