FAULT ISOLATION IN ELECTRONIC DEVICES. VOLUME II - SURFACE TEMPERATURE GRADIENTS OF OPERATING INTEGRATED CIRCUITS.

Abstract

The research into fault isolation techniques constituted two parallel efforts, the reports are identified as Volumes I and II of this report. In the work cited herein, thermal and electzical characteristics of integrated circuits (IC's) were studied so that the status of the circuit operating conditions could be determined. Because of its stability, a precision portable potentiometer was employed with 3 mil thermocouple wire to measure temperatures. The work indicated the temperature must be measured to better than 0.1C. The limit of temperature measurements was .01C. Both 'can' and 'flat' type IC's were purchased for the tests from three companies. A total of 15 circuits were studies. The range of temperature of IC's with only power applied was from 0.73C to 11.60C above the ambient temperature. After the signal was applied, the temperature change due to the signal ranged from -0.35C to 0.42C. In one case a purchased malfunctioning IC was easily detected, i.e., the difference between 0.79C normal operation and 6.27C malfunction operation. Temperature gradients were found across only a few 'flat' and 'can' type IC's. All temperatures were therefore measured at the center of the surface of thh IC's. Heating and cooling curves were found for some IC's under selected electrical conditions. Thermistors and circuits were briefly investigated indicating further development would be required to obtain a satisfactory temperature measuring device. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1966
Accession Number
AD0487203

Entities

People

  • Eugene F. Horn
  • Eugene P. Steinmetz
  • James W. Ballard

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuits
  • Climate Change
  • Integrated Circuits
  • Isotherms
  • Malfunctions
  • Measurement
  • Potentiometers
  • Precision
  • Surface Temperature
  • Temperature Gradients
  • Thermistors
  • Thermocouples

Readers

  • Aerospace Test and Evaluation
  • Materials Science (Mechanical Engineering).
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics