EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.

Abstract

The objective of this program is to perform a critical evaluation of the Flip-Chip approach to interconnecting integrated chip circuits within a common package. The aluminum-to-aluminum ultrasonic bonding matrix experiment has been completed. A thermal soldering machine and registration jig have been designed. A Flip-Chip module has been constructed and packaging problems investigated. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 15, 1966
Accession Number
AD0487339

Entities

Organizations

  • Honeywell International, Inc.

Tags

DTIC Thesaurus Topics

  • Aluminum
  • Circuit Interconnections
  • Circuits
  • Electronic Equipment
  • Electronics
  • Flip Chips
  • Integrated Circuits
  • Modules (Electronics)
  • Packaging
  • Soldering
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering