DIELECTRIC THIN FILMS WITH INCREASED BREAKDOWN STRENGTH.
Abstract
Substrate surfaces were studied to determine blemish detail and contribution to capacitor failure. Best surfaces for capacitor construction resulted from drawn glass and flowed glaze. An adequate cleaning procedure is outlined. The first metal electrode must be specular. High substrate temperature and slow rate of evaporation contribute to rough metal films. MgF sub 2 dielectric gave poor reproducibility. ThF 4 dielectric had an average dielectric strength.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 15, 1964
- Accession Number
- AD0600316
Entities
People
- Gilbert A. St. John
- Saul W. Chaikin
Organizations
- SRI International