THERMAL CONDUCTIVITY OF COPPER-NICKEL ALLOYS AT 4.2 K

Abstract

The lattice thermal conductivity of the complete Cu-Ni alloy series at 4.2 K has been derived from the measurement of the total thermal conductivity and the electrical residual resistivity of annealed specimens. It was found that copperrich alloys decrease with increasing content of nickel. For the most nickel-rich alloy (Cu 02 Ni 98) indications of additional phonon scattering processes, perhaps by spin-disorder, are found. The influence of plastic deformation has been measured and is briefly discussed.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1964
Accession Number
AD0600457

Entities

People

  • James A. Jahoda
  • Joachim C. Erdmann

Organizations

  • Boeing

Tags

DTIC Thesaurus Topics

  • Alloys
  • Conductivity
  • Copper
  • Copper Alloys
  • Copper Nickel Alloys
  • Data Acquisition
  • Electrical Conductivity
  • Heat Treatment
  • Measurement
  • Nickel
  • Nickel Alloys
  • Physics Laboratories
  • Resistance
  • Scattering
  • Thermal Conductivity
  • Thermal Resistance
  • Transition Metals

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.