THERMAL CONDUCTIVITY OF COPPER-NICKEL ALLOYS AT 4.2 K
Abstract
The lattice thermal conductivity of the complete Cu-Ni alloy series at 4.2 K has been derived from the measurement of the total thermal conductivity and the electrical residual resistivity of annealed specimens. It was found that copperrich alloys decrease with increasing content of nickel. For the most nickel-rich alloy (Cu 02 Ni 98) indications of additional phonon scattering processes, perhaps by spin-disorder, are found. The influence of plastic deformation has been measured and is briefly discussed.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1964
- Accession Number
- AD0600457
Entities
People
- James A. Jahoda
- Joachim C. Erdmann
Organizations
- Boeing