PRODUCTION ENGINEERING MEASURE TO IMPROVE PRODUCTION TECHNIQUES AND TO INSURE THE RELIABILITY OF THE C600 SERIES FIELD EFFECT TRANSISTORS.

Abstract

Ultrasonic Bonding - Improvements have been made in wire feed and in the mount holder to facilitate bonding. In addition, slice probing has been inaugurated to increase the efficiency of the bonder. Die-To-Header Bonding - A die to header bonder has been purchased and installed. Best results have been obtained by applying the gold directly to the slice and thus eliminating the S1 O2 film. Masks and Alignment System The mask spacings have been reduced to take advantage of the improved alignment technology. This has resulted in a significant improvement in the Gm/IA ratio. Etching Fixture - The mesa etching fixture has been installed in the production process. Work on a slice preparation fixture is continuing. A final design of the life test racks has been made, and the first samples will be available at the end of April. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1964
Accession Number
AD0601433

Entities

People

  • John R. Williams

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Efficiency
  • Engineering
  • Field Effect Transistors
  • Life Tests
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Reliability
  • Transistors

Readers

  • Aerospace Test and Evaluation
  • Integrated Circuit Design and Technology.
  • Nanofabrication and Microfabrication.

Technology Areas

  • Space
  • Space - Hall-Effect Thruster