ENHANCED MICRO-MODULE INTERCONNECTIONS. AN HERMETIC PACKAGING SYSTEM FOR THE INTEGRATION OF MICRO CIRCUITS.
Abstract
Six engineering model design enhanced micro-modules were assembled and submitted to environmental testing: thermal shock, vibration and mechanical shock. Engineering model design units were provided with microwafers with suitably shorted terminations which permit weld resistance monitoring during vibration and establishment of weld degradation, if any, after environmental testing. Several ten stage binary divider enhanced micro-modules were assembled up to the hermetic sealing step and found to be operative. Microwafers with either copper or nickel electroplated terminations were used extensively for the assembly of engineering model design and functional modules. In this type of pilot production environment it was observed that the yield with nickel terminated microwafers is considerably higher than with copper plated ones. The previously assembled machines were subjected to operational check-outs to establish compatibility with the overall process. The microwafer stack multiweld machine, as well as the can-header sealing machine, are in the process of being developed and integrated with the automatic wire programmer. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 01, 1964
- Accession Number
- AD0602271