A POROUS SUBSTRATE RESISTOR AIMED AT MINIATURIZATION OF METAL-FILM RESISTORS.

Abstract

Cut quartz and molded quartz substrates were produced which show much greater structural uniformity than any other material previously evaluated. Accurate metallizing time was established by evacuating substrates prior to immersion. The system is mechanically controlled. A new braze technique (direct braze method), which eliminates the fritted terminal, promotes complete coverage of the substrate-terminal interface during metallization. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 31, 1964
Accession Number
AD0602366

Entities

People

  • R. E. Busch
  • T. Matley

Tags

DTIC Thesaurus Topics

  • Film Resistors
  • Films
  • Materials
  • Metal Films
  • Metallizing
  • Miniaturization
  • Resistors
  • Substrates
  • Terminals
  • Textiles

Readers

  • Electrical Engineering
  • Surface Engineering/Surface Coating Technology.
  • Thermal Physics or Thermal Science.