PRODUCTION ENGINEERING MEASURES TO INCREASE TRANSISTOR RELIABILITY.
Abstract
Contents: Silicon Material Preparation Thermal Dissipation of the Package Assembly Cleaning Techniques Final Preparation Prior to Sealing-Parts Cleaning Controlled Formation of Surface Oxides Controlled Assembly Technique Cold Welding Post Weld Conditioning
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 30, 1964
- Accession Number
- AD0602940
Entities
People
- Doyce R. Briggs
Organizations
- Texas Instruments